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bq29440 , bq2944l0 bq29449 , bq2944l9 www.ti.com slusa15b ? march 2010 ? revised june 2010 voltage protection for 2-series, 3-series, or 4-series cell li-ion batteries (second-level protection) check for samples: bq29440 , bq2944l0 , bq29449 , bq2944l9 1 features applications ? second-level protection in li-ion battery ? 2-series, 3-series, or 4-series cell secondary packs protection ? notebook computers ? external capacitor-controlled delay timer ? power tools ? low power consumption i cc < 2 a typical ? portable equipment and instrumentation [v cell (all) < v protect ] ? high-accuracy overvoltage protection: 25 mv with t a = 0 c to 60 c ? fixed overvoltage protection thresholds: 4.30 v, 4.35 v ? small 8l qfn package description the bq2944x is a secondary overvoltage protection ic for 2-series, 3-series, or 4-series cell lithium-ion battery packs that incorporates a high-accuracy precision overvoltage detection circuit. function the voltage of each cell in a battery pack is compared to an internal reference voltage. if any cells reach an overvoltage condition, the bq2944x device starts a timer that provides a delay proportional to the capacitance on the cd pin. upon expiration of the internal timer, the out pin changes from a low state to a high state. an optional latch configuration is available that holds the out pin in a high state indefinitely after an overvoltage condition has satisfied the specified delay timer period. the latch is released when the cd pin is shorted to gnd. t t 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2010, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. p0012-02 drb package (top view) 1 2 3 4 5 6 7 8 outvdd cd vc4 vc1 vc2 vc3 gnd
bq29440 , bq2944l0 bq29449 , bq2944l9 slusa15b ? march 2010 ? revised june 2010 www.ti.com these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. ordering information (1) ta part number out pin package package package ovp ordering information (2) latch designator marking tape and reel tape and reel option (large) (3) (small) (4) -40 c bq29440 no qfn-8 drb 440 4.35 v bq29440drbr bq29440drbt to bq2944l0 yes 44l0 4.35 v bq2944l0drbr bq2944l0drbt +85 c bq29449 no 449 4.30 v BQ29449DRBR bq29449drbt bq2944l9 yes 44l9 4.30 v bq2944l9drbr bq2944l9drbt (1) example: bq2944l0drbr is a device with the out latch option with a v ov threshold of 4.35 v. contact texas instruments for other v ov threshold options. (2) for the most current package and ordering information, see the package addendum at the end of this document, or the ti website at www.ti.com. (3) large tape and reel quantity is 3,000 units. (4) small tape and reel quantity is 250 units. thermal information bq2944x thermal metric (1) drb units 8 pins q ja junction-to-ambient thermal resistance (2) 50.5 q jc(top) junction-to-case(top) thermal resistance (3) 25.1 q jb junction-to-board thermal resistance (4) 19.3 c/w y jt junction-to-top characterization parameter (5) 0.7 y jb junction-to-board characterization parameter (6) 18.9 q jc(bottom) junction-to-case(bottom) thermal resistance (7) 5.2 (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . (2) the junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a jedec-standard, high-k board, as specified in jesd51-7, in an environment described in jesd51-2a. (3) the junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. no specific jedec-standard test exists, but a close description can be found in the ansi semi standard g30-88. (4) the junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the pcb temperature, as described in jesd51-8. (5) the junction-to-top characterization parameter, y jt , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining q ja , using a procedure described in jesd51-2a (sections 6 and 7). (6) the junction-to-board characterization parameter, y jb , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining q ja , using a procedure described in jesd51-2a (sections 6 and 7). (7) the junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. no specific jedec standard test exists, but a close description can be found in the ansi semi standard g30-88. pin functions pin name pin no. description cd 6 connection to external capacitor for programmable delay time gnd 4 ground pin out 8 output vc1 1 sense voltage input for top cell vc2 2 sense voltage input for second-to-top cell vc3 3 sense voltage input for third-to-top cell vc4 5 sense voltage input for fourth-to-top cell (bottom cell) vdd 7 power supply 2 submit documentation feedback copyright ? 2010, texas instruments incorporated product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9
bq29440 , bq2944l0 bq29449 , bq2944l9 www.ti.com slusa15b ? march 2010 ? revised june 2010 functional block diagram absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) value / units supply voltage range, v max v dd ? gnd ? 0.3 to 28 v vc1 ? gnd, vc2 ? gnd, vc3 ? gnd ? 0.3 to 28 v input voltage range, v in vc1 ? vc2, vc2 ? vc3, vc3 ? vc4, vc4 ? gnd ? 0.3 to 8 v cd ? gnd ? 0.3 to 8 v output voltage range, v out out ? gnd ? 0.3 to 28 v storage temperature range, t stg ? 65 c to 150 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions min nom max unit supply voltage, v dd 4 25 v input voltage range vc1 ? vc2, vc2 ? vc3, vc3 ? vc4, vc4 ? gnd 0 5 v t d(cd) delay-time capacitance c cd (see figure 7 .) 0.1 f voltage monitor filter resistance r in (see figure 7 .) 0.1 1 k voltage monitor filter capacitance c in (see figure 7 .) 0.01 0.1 f supply voltage filter resistance r vd (see figure 7 .) 0.1 1 k supply voltage filter capacitance c vd (see figure 7 .) 0.1 f operating ambient temperature range, t a ? 40 110 c copyright ? 2010, texas instruments incorporated submit documentation feedback 3 product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9 out vc1 vc2vc3 vc4 gnd vdd cd r in r in r in r in c in c in c in c in r vd c vd 140 na 1.2 v (typ) c cd b0394-01
bq29440 , bq2944l0 bq29449 , bq2944l9 slusa15b ? march 2010 ? revised june 2010 www.ti.com electrical characteristics typical values stated where t a = 25 c and v dd = 17 v, min/max values stated where t a = ? 40 c to 110 c and v dd = 4 v to 25 v (unless otherwise noted). parameter test condition min nom max unit overvoltage bq29449 4.30 v protect detection v bq29440 4.35 voltage overvoltage detection v hys for non-latch devices only 200 300 400 mv hysteresis overvoltage detection v oa t a = 25 c ? 10 10 mv accuracy t a = 0 c to 60 c ? 0.4 0.4 overvoltage threshold v oa_drift (1) mv/ c temperature drift t a = ? 40 c to 110 c ? 0.6 0.6 t a = 0 c to 60 c 6.5 8.5 13 note: does not include external capacitor variation overvoltage delay time x delay s/ f scale factor t a = ? 40 c to 110 c 6.0 8.5 16 note: does not include external capacitor variation overvoltage delay time x delay_ctm scale factor in customer see customer test mode . 0.08 s/ f test mode overvoltage detection i cd(chg) (see figure 1 .) 140 na charging current overvoltage detection i cd(dsg) (see figure 2 .) 60 a discharging current overvoltage detection v cd external capacitor 1.2 v comparator threshold (vc1 ? vc2) = (vc2 ? vc3) = (vc3 ? vc4) = (vc4 ? gnd) = 3.5 v i cc supply current 2 3.5 a (see figure 3 .) (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) and (vc4 ? gnd) = v protect max, v dd = 20v, 6.5 8.0 9.5 v i oh = 0 to -10 a (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) and v out out pin drive voltage (vc4 ? gnd) = v protect max, v dd = 4v, 2.0 3.0 3.5 v i ol = -10 a, t a = 0 c to 60 c (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) and 0.1 v (vc4 ? gnd) = 4 v, i ol = 0 a out = 0 v, (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) or i out(short) out short circuit current 4 ma (vc4 ? gnd) > v protect , v dd = 18 v t r(out) (1) out output rise time c l = 1 nf, v dd = 4 v to 25 v, v oh(out) = 0 v to 5 v 5 s z o(out) (1) out output impedance 2 k measured at vc1, (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) and (vc4 ? gnd) = 3.5 v, ? 0.3 1.5 a t a = 0 c to 60 c (see figure 3 .) i in input current at vcx pins measured at vc2, vc3 or vc4, (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4) and (vc4 ? gnd) = 3.5 v, ? 0.3 0.3 a t a = 0 c to 60 c (see figure 3 .) (1) specified by design. not 100% tested in production. 4 submit documentation feedback copyright ? 2010, texas instruments incorporated product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9
bq29440 , bq2944l0 bq29449 , bq2944l9 www.ti.com slusa15b ? march 2010 ? revised june 2010 typical characteristics figure 1. i cd charge current figure 2. i cd discharge current figure 3. i cc , i in measurement applications information protection (out) timing and delay time capacitor sizing the bq2944x uses an external capacitor to set delay timing during an overvoltage condition. when any of the cells exceed the overvoltage threshold, the bq2944x activates an internal current source of nominally 140 na, which charges the external capacitor. when the external capacitor charges up to a voltage of nominally 1.2 v, the out pin transitions from a low state to a high state, by means of an internal pull-up network, to a regulated voltage of no more than 9.5 v when i oh = 0 ma. copyright ? 2010, texas instruments incorporated submit documentation feedback 5 product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9 temperature ( c) i cd charge current (na) i cd charge current vs temperature -40 -20 0 20 40 60 80 100 -180 -170 -160 -150 -140 -130 -120 -110 -100 -90 -80 g001 temperature ( c) i cd discharge current ( a) i cd discharge current vs temperature 40 45 50 55 60 65 70 75 80 -40 -20 0 20 40 60 80 100 g002 1 2 3 4 8 7 6 5 vc1 vc2 vc3 gnd out vdd cd vc4 i cc i in i in i in i in
bq29440 , bq2944l0 bq29449 , bq2944l9 slusa15b ? march 2010 ? revised june 2010 www.ti.com figure 4. timing for overvoltage sensing sizing the external capacitor is based on the desired delay time as follows: where t d is the desired delay time and x delay is the overvoltage delay time scale factor, expressed in seconds per microfarad. x delay is nominally 8.5 s/ f. for example, if a nominal delay of 3 seconds is desired, the customer should use a ccd capacitor that is 3 s / 8.5 s/ f = 0.35 f. the delay time is calculated as follows: if the cell overvoltage condition is removed before the external capacitor reaches the reference voltage, the internal current source is disabled and an internal discharge block is employed to discharge the external capacitor down to 0 v. in this instance, the out pin remains in a low state. for latched versions of the bq2944x, if an overvoltage condition has caused the out pin to transition to a high state, the external capacitor remains charged even after the overvoltage condition has been removed. in this instance, the out pin remains in a high state. for non-latched versions, the out pin is allowed to transition back from a high to low state when the overvoltage condition is no longer present, and the external capacitor is discharged down to 0 v. 6 submit documentation feedback copyright ? 2010, texas instruments incorporated product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9 [ ] cd d cd 1.2 v c t i = out l h v protect v C protect v hys cell voltage vc1Cvc2 vc2Cvc3 vc3Cvc4 vc4Cgnd t0461-01 t d cd delay d t = c x
bq29440 , bq2944l0 bq29449 , bq2944l9 www.ti.com slusa15b ? march 2010 ? revised june 2010 battery connection for 2-series, 3-series, and 4-series cell configurations figure 5 , figure 6 , and figure 7 show the 2-series, 3-series, and 4-series cell configurations. figure 5. 2-series cell configuration figure 6. 3-series cell configuration figure 7. 4-series cell configuration copyright ? 2010, texas instruments incorporated submit documentation feedback 7 product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9 1 2 3 4 8 7 6 5 vc1 vc2 vc3 gnd out vdd cd vc4 r vd r in r in r in c in c in c in c vd c cd 1 2 3 4 8 7 6 5 vc1 vc2 vc3 gnd out vdd cd vc4 r vd r in r in r in r in c in c in c in c in c vd c cd 1 2 3 4 8 7 6 5 vc1 vc2 vc3 gnd out vdd cd vc4 r vd r in r in c in c in c vd c cd
bq29440 , bq2944l0 bq29449 , bq2944l9 slusa15b ? march 2010 ? revised june 2010 www.ti.com cell connection sequence the recommended cell connection sequence begins from the bottom of the stack, as follows: 1. gnd 2. vc4 3. vc3 4. vc2 5. vc1 while not advised, connecting the cells in a sequence other than that described above does not result in errant activity on the out pin. for example: 1. gnd 2. vc4, vc3, vc2, or vc1 3. remaining vcx pin 4. remaining vcx pin 5. remaining vcx pin it is also recommended that the overvoltage delay timing capacitor, c cd , be propagated before connecting the cells. customer test mode customer test mode (ctm) helps to greatly reduce the overvoltage detection delay time and enable quicker customer production testing. this mode is intended for quick-pass board-level verification tests, and, as such, individual cell overvoltage levels may deviate slightly from the specifications (v protect , v oa ). if accurate overvoltage thresholds are to be tested, use the standard delay settings that are intended for normal use. to enter ctm, v dd should be set to approximately 9.5 v higher than vc1. when ctm is entered, the device switches from the normal overvoltage delay time scale factor, x delay , to a significantly reduced factor, x delay_ctm , thereby reducing the delay time during an overvoltage condition. the ctm overvoltage delay time is similar to the equation presented in protection (out) timing and delay time capacitor sizing with the substitution of x delay_ctm in place of x delay : caution avoid exceeding any absolute maximum voltages on any pins when placing the part into customer test mode. also, avoid exceeding absolute maximum voltages for the individual cell voltages (vc1 ? vc2), (vc2 ? vc3), (vc3 ? vc4), and (vc4 ? gnd). stressing the pins beyond the rated limits may cause permanent damage to the device. to exit ctm, the device should be powered off before being powered back on. for latched versions of the bq2944x, the external c cd capacitor must be externally discharged if any overvoltage functionality is exercised during protection testing. this can be accomplished by shorting the cd pin to gnd. if the c cd capacitor is not explicitly discharged, a residual charge may cause the overvoltage delay time to be inaccurate. space 8 submit documentation feedback copyright ? 2010, texas instruments incorporated product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9 d _ ctm delay _ ctm cd t c x =
bq29440 , bq2944l0 bq29449 , bq2944l9 www.ti.com slusa15b ? march 2010 ? revised june 2010 revision history changes from original (march 2010) to revision a page ? changed v out first test condition - from: v dd = 25v to: v dd = 20v. max value from: 9.0 to 9.5 .................................. 4 changes from revision a (march 2010) to revision b page ? changed the low power consumption value from 3 a to 2 a typical ............................................................................... 1 ? changed the ordering information ....................................................................................................................................... 2 ? changed the functional block diagram ............................................................................................................................... 3 ? changed the electrical characteristics ................................................................................................................................. 4 ? changed the protection (out) timing section to protection (out) timing and delay time capacitor sizing ...................... 5 ? added the 2-series and 3-series cell configurations ............................................................................................................. 7 ? added the cell connection sequence section ..................................................................................................................... 8 ? changed the test mode section .......................................................................................................................................... 8 copyright ? 2010, texas instruments incorporated submit documentation feedback 9 product folder link(s): bq29440 bq2944l0 bq29449 bq2944l9
package option addendum www.ti.com 14-jun-2010 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) bq29440drbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year request free samples bq29440drbt active son drb 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year purchase samples BQ29449DRBR active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year request free samples bq29449drbt active son drb 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year purchase samples bq2944l0drbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year request free samples bq2944l0drbt active son drb 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year purchase samples bq2944l9drbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year request free samples bq2944l9drbt active son drb 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year purchase samples (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature.
package option addendum www.ti.com 14-jun-2010 addendum-page 2 important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant bq29440drbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq29440drbt son drb 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 BQ29449DRBR son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq29449drbt son drb 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq2944l0drbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq2944l0drbt son drb 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq2944l9drbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 bq2944l9drbt son drb 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 package materials information www.ti.com 20-jul-2010 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) bq29440drbr son drb 8 3000 346.0 346.0 29.0 bq29440drbt son drb 8 250 190.5 212.7 31.8 BQ29449DRBR son drb 8 3000 346.0 346.0 29.0 bq29449drbt son drb 8 250 190.5 212.7 31.8 bq2944l0drbr son drb 8 3000 346.0 346.0 29.0 bq2944l0drbt son drb 8 250 190.5 212.7 31.8 bq2944l9drbr son drb 8 3000 346.0 346.0 29.0 bq2944l9drbt son drb 8 250 190.5 212.7 31.8 package materials information www.ti.com 20-jul-2010 pack materials-page 2

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dlp? products www.dlp.com communications and www.ti.com/communications telecom dsp dsp.ti.com computers and www.ti.com/computers peripherals clocks and timers www.ti.com/clocks consumer electronics www.ti.com/consumer-apps interface interface.ti.com energy www.ti.com/energy logic logic.ti.com industrial www.ti.com/industrial power mgmt power.ti.com medical www.ti.com/medical microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com space, avionics & www.ti.com/space-avionics-defense defense rf/if and zigbee? solutions www.ti.com/lprf video and imaging www.ti.com/video wireless www.ti.com/wireless-apps mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2010, texas instruments incorporated

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